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8D Problem Solving Report

Document Reference: NCR#26-0244

Organization: Beacon Circuits

Report Date: June 2026

Cycle: 1 (open — D6 verification pending)

8D Lead: Anna Novak, SMT Process Engineer

Regulatory / Quality Frame: ISO 9001, IPC J-STD-001, IPC-A-610 Class 2

D1 — Team

Name / RoleExpertiseResponsibility in this 8D
Anna Novak — SMT Process EngineerSMT process, reflow profiling, solder materials8D Lead; production board profile; corrective action ownership (RC-2 documentation updates)
Raj Patel — Reflow Oven TechnicianOven profiling, maintenance, zone diagnosticsZone 7 inspection and diagnosis; independent temperature verification; return-to-service steps
Maria Sanchez — Incoming InspectorPaste and component receiving, COA reviewTraceability pull; full COA #SAC-0339 parameter review
Dan Kim — Quality InspectorX-ray inspection, AOI100% X-ray screen of #1913 suspect-window output; defect stratification by location, board serial, lane/orientation
Linda Chen — 1st Shift SMT SupervisorProduction scheduling, shift coverageShip log reconciliation (OCA-1); #1913 other-PN assessment (OCA-2); return-to-service production sign-off
Supplier Quality EngineerSupplier interfaceTBD — to be assigned if paste-oven interaction confirmed by Cycle 2 data

D2 — Problem Description

Problem Statement:

> QFN-48 thermal-pad joints on Reflow Oven #1913 show cold joints and insufficient wetting at 4.2% (84/2,000 inspected) against a <0.5% target, first observed in June 2 output — Ovens #1911 and #1912 running the same assembly with the same paste and print process show 0.3%.

IS / IS NOT Analysis:

DimensionIS (problem exists)IS NOT (problem does not exist)
WhatCold joints and insufficient wetting on QFN-48 ground-pad thermal via array (highest thermal-mass location on board)QFN-48 perimeter pins (not failing); other component types (not reported failing — TBD pending Dan Kim's defect breakdown by joint type)
WhereReflow Oven #1913; Zone 7 reading 5°C below programmed setpoint per oven thermocouple history logOvens #1911 and #1912 (all zones within ±2°C of setpoint); board lane position and orientation — TBD pending Dan Kim's stratification
WhenFirst defects in #1913 output June 2; paste lot PST-26-0339 introduced June 1; zone 7 drift observed week of June 1 by Raj Patel; zone 7 drift onset TBD (within April 28 – early June window)No elevated defects before June 2; #1913 passed full KIC profile verification April 28, 2026 (240°C peak, 60–70s TAL)
How Many84 of 2,000 QFN joints inspected from #1913 output — 4.2% defect rate; #1911/#1912 combined: 6 of 2,000 — 0.3%1,916 of 2,000 inspected joints passed on #1913; per-board distribution (scattered vs. clustered) — TBD pending Dan Kim's stratification by board serial

Evidence referenced:

D3 — Interim Containment Action (ICA)

ICA Taken:

1. New-build WIP halted on #1913 for this part number; builds diverted to #1911 and #1912

2. 100% X-ray inspection (Dan Kim) of all #1913 QFN output in suspect window; confirmed defective joints being reworked

3. NCR#26-0244 opened June 5; traceability pull executed on last 8 days of paste lots, board lots, and oven profile changes

4. Customer complaint queue reviewed — no complaints received as of NCR opening

Implemented By: Anna Novak (lead), Dan Kim (X-ray execution), NCR opened June 5

Date: Containment initiated June 5; 100% X-ray screen start date TBD — Anna Novak to confirm with Dan Kim

ICA Verified Effective: Partial. Production halt and diversion to #1911/#1912 are in place and functioning. 100% X-ray retrospective screen is in progress; rework of confirmed defects is ongoing. Two open containment actions remain unverified:

Evidence referenced:

D4 — Root Cause Analysis

Investigation Method: 6M Fishbone + 5-Why, building on the IS/IS NOT analysis in D2

6M Fishbone (breadth):

Machine

Method

Material

Measurement

Man (People)

Environment (Mother Nature)

5-Why Analysis:

Chain 1 — Why did it happen (RC-1):

Why #QuestionAnswerEvidence
Why 1Why are QFN-48 thermal pad joints cold / insufficiently wetted on #1913?Solder at the thermal via array is not reaching adequate temperature above liquidus for sufficient time — incomplete melt and wetting. Thermal pad is the highest thermal-mass location on the board; it is the last to reach temperature and on #1913 it is not getting there or barely getting there. Perimeter pins on the same package wet fine — consistent with a thermal gradient, not paste chemistry.Dan Kim 100% X-ray results: failure isolated to thermal via array; perimeter pins passing. Direct pad temperature measurement: TBD — production board profile on #1913 not yet run.
Why 2Why is the QFN-48 thermal pad not receiving adequate heat on #1913?Zone 7 on #1913 is delivering less heat than programmed — reading 5°C below setpoint — while #1911/#1912 hold all zones within ±2°C of setpoint. This is the oven-specific differentiator.Oven thermocouple history log — #1913 Zone 7 deviation (Raj Patel, week of June 1). Zone 7 position in recipe (soak / ramp-to-peak / peak): TBD — Raj Patel to confirm.
Why 3Why is Zone 7 on #1913 running 5°C below its programmed setpoint?Hardware-level mechanism TBD pending Raj Patel's zone inspection. Candidates: heater element degradation, zone thermocouple drift, controller issue.No direct evidence yet — Raj Patel zone inspection is the required next step.
Why 4Why did the Zone 7 deficit not get detected before it caused defects?No routine review of #1913's zone thermocouple history log exists; no alarm threshold is configured for zone deviation from setpoint. The data was recorded by the oven continuously — the signal existed — but nothing in the process consumed it. Raj found the deviation by chance.Raj Patel's observation (week of June 1) — found by chance, not by systematic review. No documented monitoring requirement identified.
Why 5Why is there no routine monitoring of oven zone thermocouple history logs with alarm thresholds?← RC-2 Root Cause: The process control plan designates periodic KIC profile verification as the sole thermal control for reflow ovens. Oven zone log monitoring was never defined as a required activity — no assigned owner, no review interval, no alarm thresholds. The requirement does not exist.Raj found deviation by chance rather than by systematic trigger — no documented monitoring requirement. Control plan and reflow PFMEA pull: TBD — Anna Novak to confirm requirement was never defined.

Root Cause Statement:

> RC-1 — Zone 7 Thermal Deficit (Hardware): Reflow Oven #1913 Zone 7 is delivering insufficient heat — 5°C below programmed setpoint — causing the QFN-48 thermal via array (highest thermal-mass location on board) to receive inadequate time above liquidus, producing cold joints and insufficient wetting. Hardware mechanism (heater element, thermocouple, or controller) — TBD pending Raj Patel's inspection.

> Verdict: LEADING — strongest IS/IS NOT support; consistent physical mechanism; oven-specific contrast confirmed. Advances to PROBABLE when zone 7 position in recipe confirmed and hardware inspected; advances to CONFIRMED when production board profile shows QFN thermal pad TAL below spec on #1913 under current oven condition.

> RC-2 — Absence of Oven Zone Monitoring Requirement (Systemic): The process control plan has never designated routine monitoring of oven zone thermocouple history logs as a required activity. No alarm thresholds, no review owner, no review interval exist for zone deviation detection. This gap allowed Zone 7's thermal deficit to develop and persist undetected until it caused product failures.

> Verdict: PROBABLE — finding stands independent of RC-1 hardware diagnosis; no contradicting evidence. Advances to CONFIRMED when control plan pull confirms the monitoring requirement was never defined.

Ruled-Out Hypotheses:

HypothesisRuled Out By
Paste lot PST-26-0339 as standalone root causeSame lot running on #1911/#1912 via shared stencil printer at 0.3% — if paste were independently sufficient, those ovens would show elevated defects. Ag 2.8% is within J-STD-006 spec (2.5–4.0%); not a nonconformance.
Operator / shift-specific causeDefect pattern tracks Reflow Oven #1913, not any specific operator or shift. All three ovens run same programmed recipe; no dedicated per-oven operator; no training gaps flagged.
Print-side cause (new squeegee WO-26-0610)SPI confirms paste volume within ±10% of target on boards routed to all three ovens. A print-side cause would not be oven-specific.
Environmental / ambient conditionsAll three ovens in same climate-controlled SMT area. Nitrogen purity checked — no deviation. No HVAC anomalies or location-specific factors identified.
Paste-oven interaction (H2) as co-equal causePST-26-0339 running on #1911/#1912 at 0.3% rules out paste as independently sufficient. H2 retained as suspected aggravating factor — NOT CURRENTLY SUPPORTED as co-equal; drift onset date is the discriminating datum that would resolve it.

Escape Point:

> RC-1 Escape Point — Zone 7 thermocouple history log (unmonitored): The Zone 7 thermal deficit was recorded continuously in #1913's own oven data from drift onset. This signal should have triggered detection at or near the onset of the drift — well before product was affected. It did not, because no process requirement exists for reviewing this data (RC-2). The periodic KIC verification is not an effective backstop: the ~5-week verification interval allows drift to develop undetected, and the gold-board fixture does not measure QFN thermal pad temperature — the location with least thermal margin.

> Escape Point Verdict: PROBABLE — the unmonitored zone log as the missed detection opportunity is directly supported by Raj's chance-observation finding. Confirmed when control plan pull shows zone log monitoring was never a defined requirement.

Escape Surfaces:

Cause Completeness:

Root Cause Verified: No — verification experiment designed and accepted by the team; results pending execution (see Open Items).

Evidence referenced:

D5 — Permanent Corrective Actions (PCA)

Verification actions (not corrective): Root Cause Verified is No for both RC-1 and RC-2. The following actions exist to CONFIRM the suspected causes, not to correct them, and are not counted as PCAs:

#ActionConfirmsOwner
V1Zone 7 hardware diagnosis (heater element, thermocouple, controller inspection)RC-1 hardware mechanismRaj Patel
V2Independent zone temperature verification — calibrated external thermocouple, all zonesRC-1 — real deficit vs. sensor artifactRaj Patel
V3Production board profile — thermocouples at QFN-48 thermal via arrayRC-1 — direct pad temperature/TAL measurement; the primary RC-1 confirming testAnna Novak / Raj Patel
V4Zone 7 drift onset walkback — oven thermocouple history logDiscriminates H2 (interaction) vs. coincidence; refines RC-1 timelineRaj Patel
V5Process control plan pullRC-2 — confirms monitoring requirement was never definedAnna Novak
V6Reflow PFMEA pullRC-2 escape point — confirms whether zone drift is listed as a failure modeAnna Novak
V7Full COA #SAC-0339 parameter review (flux activity, metal load, particle size, viscosity)Rules in/out additional material deviations beyond Ag% and liquidusMaria Sanchez
V8Defect stratification — location breakdown, per-board distribution, lane/orientationRC-1 spatial mechanism (scattered vs. clustered pattern)Dan Kim

Permanent Corrective Actions:

#ActionAddressesOwnerTarget Date
1Repair or replace the Zone 7 component identified by diagnosis (V1) as failed — scope defined once mechanism is knownRC-1, once diagnosis confirms mechanismRaj PatelTBD — pending diagnosis (V1)
2If diagnosis (V1) identifies an age/wear-related mechanism: add a preventive check for that component to the oven PM procedure, all three ovensRC-1 recurrence preventionRaj Patel / Anna NovakTBD — pending diagnosis
3Configure zone deviation alarms on all zones, all three ovens — alert limit TBD (starting point ±3°C, to be confirmed from normal variation data); alarm pages technician on deviationRC-2 — primary detection gap ("signal existed, nothing consumed it")Raj PatelTBD — pending management sign-off
4Define documented weekly zone log review — Raj Patel (reflow technician role) as owner, auditable review recordRC-2 — primary detection gapRaj PatelTBD — pending management sign-off
5Update process control plan — add zone temperature monitoring as a required control line with owner, review interval, and alarm thresholdsRC-2 — documentation of the systemic control gapAnna NovakTBD — pending management sign-off
6Update reflow PFMEA — add zone-level thermal drift as failure mode; score new detection controls; document RPN reductionRC-2 — risk documentation gapAnna NovakTBD — pending management sign-off
7Update profile verification method — add production-board or thermally representative check for high thermal-mass QFN pad location; retire sole reliance on gold-board fixture for worst-case joint verificationRC-2 — verification method blind spot (applies regardless of RC-1 diagnosis outcome)Anna Novak / Raj PatelTBD — pending management sign-off

Note on Actions 3–7: These target RC-2, graded PROBABLE. The underlying finding — no monitoring requirement currently exists — is already directly evidenced by Raj's chance discovery of the deviation and the absence of any documented review trigger; V5/V6 (control plan and PFMEA pulls) will formalize the citation but the systemic gap itself is not in serious dispute. Actions 1–2 target RC-1 and are contingent on V1's diagnosis; the specific repair scope cannot be finalized until then.

PST-26-0339 Paste Lot Disposition:

Return-to-Service Criteria for #1913 (gates release back to unrestricted production; sequenced after PCA #1 repair):

1. Zone 7 verified at setpoint under independent measurement (V2 repeated post-repair) — all zones within ±2°C, matching #1911/#1912

2. Full KIC profile verification passed

3. Production board profile (V3 repeated post-repair) confirms QFN thermal pad peak temperature and TAL in spec

4. Re-qualification build with 100% X-ray on QFN joints — defect rate at baseline (≤0.3%) before unrestricted release. Owners: Dan Kim (X-ray), Linda Chen (production release), Anna Novak (process release decision)

Evidence referenced:

D6 — Implement & Verify Effectiveness

No corrective actions have been implemented yet. No verification actions have been executed yet. This section will be populated in Cycle 2.

Action #Implemented? (Y/N, date)Effectiveness Result (data, or "pending — check due [date]")
PCA 1 — Zone 7 repairNoPending — check due: after V1 diagnosis, target within 5 business days of report date per team's accepted experiment window
PCA 2 — PM procedure update (if age/wear)NoPending — contingent on V1 diagnosis result
PCA 3 — Zone deviation alarms configuredNoPending — management sign-off required
PCA 4 — Weekly zone log review definedNoPending — management sign-off required
PCA 5 — Process control plan updatedNoPending — management sign-off required
PCA 6 — Reflow PFMEA updatedNoPending — management sign-off required
PCA 7 — Profile verification method updatedNoPending — management sign-off required

Effectiveness criteria to be checked in Cycle 2 (not yet met):

D7 — Prevent Recurrence

Similar processes/products to review:

Documents to update:

DocumentWhat to ChangeOwner
Process Control Plan — reflow processAdd zone temperature monitoring as a required control line: owner (Raj Patel, reflow technician role), review interval (weekly minimum, per Anna's proposal), alarm thresholds (TBD — confirm from normal variation data, starting point ±3°C)Anna Novak
Reflow PFMEAAdd zone-level thermal drift as a failure mode; assign detection controls (zone alarms + log review); score updated RPN; document RPN reductionAnna Novak
Profile Verification ProcedureAdd requirement for production-board or thermally representative profile check at high thermal-mass locations (QFN thermal pad); define when required (new assembly qualification, post-repair return-to-service, periodic re-verification interval TBD)Anna Novak / Raj Patel
Oven PM Procedure — #1913 (and #1911/#1912)Add zone thermocouple and heater element condition check at PM interval; if V1 diagnosis reveals age/wear mechanism, add specific preventive check and replacement intervalRaj Patel
Internal Audit Checklist / ScopeAdd an adequacy check for process control plan detection controls — current audit scope checks conformance to the plan, not adequacy of the controls defined in it; the zone monitoring gap was invisible to the current audit approachTBD — Quality / Internal Audit function

Lessons Learned:

1. An oven-specific defect pattern is diagnostic before the fishbone is built. When one oven fails and two run clean on the same material and print process, the investigation should focus on what is different about that oven — not on what changed in the shared process inputs. The shared stencil printer was the key structural fact that broke the paste-lot hypothesis early.

2. The signal existed. The oven was recording the zone deficit continuously. The failure was not that the data was unavailable — it was that no process consumed it. Process control plans that designate periodic verification as the sole thermal control create blind spots between verification intervals.

3. A profile verification that passes does not mean the process has adequate margin at every location on every board. The gold-board KIC fixture verifies oven thermal performance at fixture thermocouple locations — it does not verify joint temperature at high thermal-mass locations on production assemblies.

4. Timeline correlation is a hypothesis, not a conclusion. The paste lot change on June 1 and first defects on June 2 produced a compelling narrative that was not the root cause — but working it through the IS/IS NOT analysis (shared printer, same paste on good ovens) broke it efficiently without discarding the material observation that became H2.

5. PFMEA adequacy is not visible to conformance audits. A missing failure mode in a PFMEA does not trip a finding when audit scope checks conformance to the documented plan rather than adequacy of the plan itself.

D8 — Closure

Closure Criteria (all must be true):

0 of 10 criteria met → closure NOT YET EARNED.

Closure Status: NOT YET EARNED. No D6 effectiveness data exists — no corrective action or verification action has been executed. The critical path is D5 V1 (Zone 7 diagnosis) and D5 V3 (production board profile), which together determine whether RC-1 advances to CONFIRMED and scope the repair. Until that data exists, this record states a grounded, evidence-based root cause analysis at LEADING/PROBABLE grade — it does not state a confirmed, corrected condition.

Investigation Summary:

QFN-48 thermal pad cold joints on Reflow Oven #1913 (4.2%, 84/2,000) were traced to a Zone 7 thermal deficit — 5°C below setpoint — delivering insufficient time above liquidus at the highest thermal-mass location on the board. The deficit went undetected because no process requirement exists for monitoring oven zone thermocouple history logs; the signal was present and unread. Paste lot PST-26-0339 was the initial leading hypothesis but was ruled out as a standalone cause by the shared stencil printer structure; it is retained as a suspected aggravating factor pending drift onset data. Two co-equal root causes have been identified and corrective/verification actions are structured; execution is pending.

Team Recognition:

Anna Novak led the investigation and revised the initial paste-lot hypothesis once the IS/IS NOT evidence did not support it. Dan Kim's 100% X-ray inspection established the quantitative foundation. Raj Patel's observation of the Zone 7 deviation was the pivotal finding. Maria Sanchez and Linda Chen hold open evidence and containment actions. Team recognition is the process owner's step — acknowledge these contributions when closing.

Open Items & Gap Impact

Gap (what's missing)Why openImpact on confidence / what conclusion could change
Zone 7 hardware mechanismV1 not yet executedRC-1 remains LEADING, not CONFIRMED. If independent measurement (V2) shows zone 7 is actually at setpoint, H1 mechanism is unsupported and the investigation must reopen. HIGH impact.
Zone 7 drift onset dateV4 not yet executedCannot determine whether drift predates the paste change (favors H2 interaction) or coincides with it (favors coincidence). MEDIUM impact on H2 verdict; does not affect RC-1 or RC-2.
Zone 7 position in recipeRaj Patel to confirmIf zone 7 is early soak rather than near peak, the mechanism connecting the 5°C deficit to pad temperature is weaker. MEDIUM impact on RC-1 mechanism confidence.
Production board profile at QFN thermal padV3 not yet executedRequired to advance RC-1 to CONFIRMED. Without it, the deficit-to-pad-temperature link is inferred, not measured. HIGH impact — this is the confirmation measurement.
Zone 7 thermocouple calibration recordRaj Patel to pullSensor-artifact possibility not fully ruled out without it, though product evidence argues against artifact. LOW-MEDIUM impact.
Control plan pull (V5)Not yet executedRequired to advance RC-2 to CONFIRMED. LOW-MEDIUM impact — underlying gap already evidenced by chance-discovery pattern.
Reflow PFMEA pull (V6)Not yet executedDetermines RC-2 escape point verdict and D7 PFMEA action scope. MEDIUM impact.
Full COA #SAC-0339 parameter review (V7)Not yet executedCould reveal additional material deviations. LOW-MEDIUM impact — current evidence does not suggest additional deviations.
Defect stratification (V8)Not yet executedScattered distribution supports systematic cause (consistent with RC-1); clustered suggests episodic cause. MEDIUM impact on RC-1 spatial mechanism.
Linda Chen OCA-1 — ship log reconciliationDue EOD June 11If suspect product shipped before containment, customer notification is required. HIGH impact on containment completeness.
Linda Chen OCA-2 — #1913 other-PN assessmentPendingIf #1913 runs other part numbers, expanded hold may be required. MEDIUM-HIGH impact on containment scope.
D6 effectiveness data — all actionsNone implementedClosure cannot be declared; D8 closure gate shows 0 of 10 criteria met. HIGH impact — this is the primary reason the record remains open.

Evidence Index

#Document / DataTypeWhere Referenced
E1Dan Kim 100% X-ray inspection results — #1913 suspect-window output (84/2,000 defective QFN joints)Inspection dataD2, D3, D4
E2Oven thermocouple history log — #1913 Zone 7 deviation (Raj Patel observation, week of June 1)Process log / equipment recordD2, D4
E3KIC Profile Verification Record — Reflow Oven #1913, April 28, 2026; 240°C peak, 60–70s TAL; passed (doc ID TBD — to be attached to NCR#26-0244)Verification recordD2, D4
E4NCR#26-0244 — opened June 5; primary traceable record for this investigationQuality recordD1, D2, D3
E5Traceability pull — last 8 days of paste lots, board lots, and oven profile changesTraceability recordD3, D4
E6COA #SAC-0339 — paste lot PST-26-0339 (Ag 2.8% cited; liquidus 219°C cited; full parameter review TBD — Maria Sanchez, V7)Supplier COAD4, D5
E7J-STD-006 — SAC305 silver content specification (2.5–4.0% Ag)Industry standardD4, D5
E8IPC-A-610 Class 2 — solder joint inspection standardIndustry standardD2, D3, D5
E9IPC J-STD-001 — soldering requirements standardIndustry standardD1, D3
E10WO-26-0610 — squeegee replacement record, May 30; SPI data confirming paste volume within ±10% on boards to all three ovensMaintenance record / SPI dataD4
E11Process control plan — reflow process (TBD pull, V5)Quality system documentD4, D5, D7
E12Reflow PFMEA (TBD pull, V6)Risk documentD4, D5, D7
E13Zone 7 thermocouple calibration record (TBD — Raj Patel to pull)Calibration recordD4
E14Dan Kim defect stratification — breakdown by joint type, board serial, conveyor lane/orientation (TBD, V8)Inspection data analysisD2, D4
E15#1913 Zone 7 hardware inspection report (TBD, V1)Equipment inspection recordD4, D5
E16Production board profile — #1913, QFN-48 thermal pad thermocouple data (TBD, V3)Process verification recordD4, D5, D6
E17Independent zone temperature verification record — all zones, #1913 (TBD, V2)Equipment verification recordD5, D6
E18Re-qualification build X-ray results — #1913 post-repair (TBD — Dan Kim / Linda Chen)Inspection dataD5, D6
E19Linda Chen ship log reconciliation — #1913 build dates June 2–5 vs. ship records (TBD — due EOD June 11)Traceability / shipping recordD3
E20Zone 7 drift onset walkback — oven thermocouple history log (TBD, V4)Process log analysisD4, D5

This is the Cycle 1 8D Problem Solving Report for NCR#26-0244. Root cause analysis is at current evidence grade (RC-1 LEADING, RC-2 PROBABLE) with Root Cause Verified = No. No corrective actions have been implemented; D6 shows 0 of 10 D8 closure criteria met. This report is a draft investigation record for review — it requires verification, approval, and sign-off by the qualified responsible party (Anna Novak, 8D Lead) via the Review & Sign-off step before it is filed or submitted as a completed record.